Processor

Review: Haswell-E 5960X Processor and Intel X99 Chipset

Intel 5960x (6)

Intel’s latest enthusiast platform as arrived. The new X99 chipset which together with the new Haswell-E platform usher in DDR4 support for insane memory speeds. The new platform contains an extensive feature list . Let’s get the review rolling and take a closer look at the new chipset and processor line-up.

 Intel X99 and Haswell-E 1 (6) Intel X99 and Haswell-E 1 (1)

The new Haswell-E processor line-up includes three new CPU’s. Starting with the bottom, we have the 5820k which includes 6-core/12 threads with 15MB of L3-Cache and is clocked at 3.3GHz with a turbo frequency up to 3.6GHz,. The 5820k includes 28-PCIE 3.0 Lanes, which is a massive leap over the 4790k’s 16 lanes. Stepping up a level we have the 5930k which again includes 6 cores/12 threads with 15MB of L3 Cache, but with a clock speed of 3.5GHz and the turbo up to 3.7GHz. It also includes 40 PCIE 3.0 lanes.

Intel X99 and Haswell-E 1 (4)

Lastly we have the 5960X, Intel’s new Desktop King. The new Extreme processor includes 8 Cores/16 Threads with 20MB of L3 cache and is clocked at 3.0GHz to start and has a turbo up to 3.5GHz. It also sports the 40 PCIE 3.0 Lanes. All new CPU’s use the new DDR4 for memory.

Intel X99 and Haswell-E 1 (7)

Straight from the chipset we can see support for 14 high speed USB ports with integrated USB 3.0 support. We also have 10 SATA 3.0 ports with 6Gbps speed. The chipset also includes 8 PCI Express 2.0 support with 5 GT/s speed.

Intel X99 Chipset Specifications

Feature Benefit
Supports Intel® Core™ i7 processors
in the LGA2011-v3 socket
Supports Intel Core i7 processors with Intel® Turbo Boost Technology 2.0.1
Overclocking2 The Intel® X99 Chipset also enables overclocking features of unlocked 4th and 5th generation Intel® Core™ processors.
Intel® Rapid Storage Technology (Intel® RST)3 With additional hard drives added, provides quicker access to digital photo, video, and data files, and greater data protection against a hard disk drive failure with RAID 0, 5, and 10.
Intel® Rapid Recover Technology Intel’s latest data protection technology helps provide a recovery point that can be used to quickly recover a system should a hard drive fail, or if there is data corruption. The clone can also be mounted as a read-only volume to allow a user to recover individual files.
Intel® High Definition Audio (Intel® HD Audio)4 Integrated audio support enables premium digital surround sound and delivers advanced features such as multiple audio streams and jack retasking.
Intel® Smart Response Technology5 Implements storage I/O caching for fast response times of application startup and quick access to user data.
Universal Serial Bus (USB) 3.0 Integrated USB 3.0 support, provides greater enhancement in performance with a design data rate of up to 5 Gb/s with up to six USB 3.0 ports.6
Universal Serial Bus 2.0 Hi-speed USB 2.0 support with a design data rate of up to 480 Mb/s with up to 14 USB 2.0 ports.
Serial ATA (SATA) 6 Gb/s Next generation high-speed storage interface supporting up to 6 Gb/s transfer rates for optimal data access with up to six SATA ports.7
eSATA SATA interface designed for use with external SATA devices. Provides a link for 3 Gb/s data speeds to eliminate bottlenecks found with current external storage solutions.
SATA port disable Enables individual SATA ports to be enabled or disabled as needed. This feature helps provide added protection of data by preventing malicious removal or insertion of data through SATA ports. Especially targeted for eSATA ports.
PCI Express* 2.0 interface Offers up to 5 GT/s for fast access to peripheral devices and networking with up to eight PCI Express 2.0 x1 ports8, configurable as x1, x2, and x4 depending on motherboard designs.
Intel Core i7 processor, PCI Express 3.0 Interface Intel X99 chipset-based platforms enable the processor PCI Express 3.0 port to be configurablem as a 2×16 and 1×8 or 5×8.9
USB port disable Enables individual USB ports to be enabled or disabled as needed. This feature helps provide added protection of data by preventing malicious removal or insertion of data through USB ports.
Intel® Integrated 10/100/1000 MAC Support for the Intel® Ethernet Connection I218-LM.
Green technology Manufactured with lead-free and halogen-free10 component packages.

Intel Core i7 5820K Specfications

Essentials
Status Launched
Launch Date Q3’14
Processor Number i7-5820K
# of Cores 6
# of Threads 12
Clock Speed 3.3 GHz
Max Turbo Frequency 3.6 GHz
Intel® Smart Cache 15 MB
Intel® QPI Speed 0 GT/s
# of QPI Links 0
Instruction Set 64-bit
Instruction Set Extensions SSE4.2, AVX 2.0, AES
Embedded Options Available No
Lithography 22 nm
Scalability 1S Only
Max TDP 140 W
Recommended Customer Price BOX : $396.00
TRAY: $389.00
Memory Specifications
Max Memory Size (dependent on memory type) 64 GB
Memory Types DDR4-1333/1600/2133
# of Memory Channels 4
Max Memory Bandwidth 68 GB/s
ECC Memory Supported No
Graphics Specifications
Processor Graphics None
Expansion Options
PCI Express Revision 3.0
Max # of PCI Express Lanes 28
Package Specifications
Max CPU Configuration 1
TCASE 66.8
Package Size 52.5mm x 45.0mm
Sockets Supported LGA2011-v3
Low Halogen Options Available See MDDS
Advanced Technologies
Intel® Turbo Boost Technology 2.0
Intel® vPro Technology No
Intel® Hyper-Threading Technology Yes
Intel® Virtualization Technology (VT-x) Yes
Intel® Virtualization Technology for Directed I/O (VT-d) Yes
Intel® VT-x with Extended Page Tables (EPT) Yes
Intel® 64 Yes
Idle States Yes
Enhanced Intel SpeedStep® Technology Yes
Intel® Demand Based Switching

No
Thermal Monitoring Technologies Yes
Intel® Identity Protection Technology Yes
Intel® Smart Response Technology Yes
Intel® Data Protection Technology
AES New Instructions Yes
Intel® Platform Protection Technology
Trusted Execution Technology No
Execute Disable Bit Yes

Intel Core i7 5930K Specfications

Essentials
Status Launched
Launch Date Q3’14
Processor Number i7-5930K
# of Cores 6
# of Threads 12
Clock Speed 3.5 GHz
Max Turbo Frequency 3.7 GHz
Intel® Smart Cache 15 MB
Intel® QPI Speed 0 GT/s
# of QPI Links 0
Instruction Set 64-bit
Instruction Set Extensions SSE4.2, AVX 2.0, AES
Embedded Options Available No
Lithography 22 nm
Scalability 1S Only
Max TDP 140 W
Recommended Customer Price BOX : $594.00
TRAY: $583.00
Memory Specifications
Max Memory Size (dependent on memory type) 64 GB
Memory Types DDR4-1333/1600/2133
# of Memory Channels 4
Max Memory Bandwidth 68 GB/s
ECC Memory Supported No
Graphics Specifications
Processor Graphics None
Expansion Options
PCI Express Revision 3.0
Max # of PCI Express Lanes 40
Package Specifications
Max CPU Configuration 1
TCASE 66.8
Package Size 52.5mm x 45.0mm
Sockets Supported LGA2011-v3
Low Halogen Options Available See MDDS
Advanced Technologies
Intel® Turbo Boost Technology 2.0
Intel® vPro Technology No
Intel® Hyper-Threading Technology Yes
Intel® Virtualization Technology (VT-x) Yes
Intel® Virtualization Technology for Directed I/O (VT-d) Yes
Intel® VT-x with Extended Page Tables (EPT) Yes
Intel® 64 Yes
Idle States Yes
Enhanced Intel SpeedStep® Technology Yes
Intel® Demand Based Switching No
Thermal Monitoring Technologies Yes
Intel® Identity Protection Technology Yes
Intel® Smart Response Technology Yes
Intel® Data Protection Technology
AES New Instructions Yes
Intel® Platform Protection Technology
Trusted Execution Technology No
Execute Disable Bit Yes

Intel Core i7 5960X Specfications

Essentials
Status Launched
Launch Date Q3’14
Processor Number i7-5960X
# of Cores 8
# of Threads 16
Clock Speed 3 GHz
Max Turbo Frequency 3.5 GHz
Intel® Smart Cache 20 MB
Intel® QPI Speed 0 GT/s
# of QPI Links 0
Instruction Set 64-bit
Instruction Set Extensions SSE4.2, AVX 2.0, AES
Embedded Options Available No
Lithography 22 nm
Scalability 1S Only
Max TDP 140 W
Recommended Customer Price BOX : $1059.00
TRAY: $999.00
Memory Specifications
Max Memory Size (dependent on memory type) 64 GB
Memory Types DDR4-1333/1600/2133
# of Memory Channels 4
Max Memory Bandwidth 68 GB/s
ECC Memory Supported

No
Graphics Specifications
Processor Graphics None
Expansion Options
PCI Express Revision 3.0
Max # of PCI Express Lanes 40
Package Specifications
Max CPU Configuration 1
TCASE 66.8
Package Size 52.5mm x 45.0mm
Sockets Supported LGA2011-v3
Low Halogen Options Available See MDDS
Advanced Technologies
Intel® Turbo Boost Technology 2.0
Intel® vPro Technology No
Intel® Hyper-Threading Technology Yes
Intel® Virtualization Technology (VT-x) Yes
Intel® Virtualization Technology for Directed I/O (VT-d) Yes
Intel® VT-x with Extended Page Tables (EPT) Yes
Intel® 64 Yes
Idle States Yes
Enhanced Intel SpeedStep® Technology Yes
Intel® Demand Based Switching No
Thermal Monitoring Technologies Yes
Intel® Identity Protection Technology Yes
Intel® Smart Response Technology Yes
Intel® Data Protection Technology
AES New Instructions Yes
Intel® Platform Protection Technology
Trusted Execution Technology No
Execute Disable Bit Yes

1. Introduction and Specifications

0

Intel launch 14nm Core M processors

intel core m

 

Intel today at Computex have announced their latest generation of Core processors dubbed Core M, which will use Intel 14nm tri-gate process. Thew new generation of processors are set to bring the thinnest tablets, with Intel stating the majority will be fanless based due to 60-percent less heat. The new processors will provide up to 40-percent better performance, while using a lot less power (around 45-percent less). They will also be 50-percent smaller physically,taking up less room inside the device.

Clearly we are seeing the real end of Windows RT and will start to see even smaller and thinner full Windows 8 tablets in the future.

0

Intel set to build €2.9 billion chip manufacturing plant in Ireland

Intel-Logo
Intel has got the thumbs up for their next chip plant in Co Kildare in Ireland. The new building which is said to cost Intel around €2.9($4) billion dollars will create up to 4,300 jobs with 3,500 being construction over a 2-year build and 800 being full time employees once finished. Intel are getting ready to manufacturer their next line of 14nm processors which follows the current work plan towards 10nm, 7nm and 5nm.

Source: SiliconRepublic

0

Qualcomm announce Snapdragon 600 and 800 chips

qualcomm-snapdragon-2012

 

Qualcomm have announced their latest chips which include a new set of branding rules. The S5 name was expected but instead the new set of chips are being called the Snapdragon 600 and 800. Both new chips over much in terms of increase performance compared to the S4 Pro. The 600 of which offers a 40% increase in performance, other specs include a new Krait 300 quad-core CPU with speeds up to 1.9GHz, a new speed enhanced Adreno 320 GPU and support for LPDDR3 memory.

While the 600 is impressive by all means, the light shines on the new 800 processor which offers a 75% increase in performance over the S4 Pro. The new Krait 400 quad-core CPU with speeds of 2.3GHz per core. Adreno 330 GPU with 2x the performance over the 320 GPU. Both the 600 and 800 chips are expected to start showing up in devices within the next few months. Check out the press release below for more information.

Qualcomm Announces Next Generation Snapdragon Premium Mobile Processors

New Snapdragon 800 and 600 Processors Represent a Significant Performance Leap For High-End Mobile Computing Devices

LAS VEGAS – January 07, 2013 – Qualcomm Incorporated (NASDAQ: QCOM) today announced that its wholly owned subsidiary, Qualcomm Technologies, Inc., is sampling the first products in its latest generation of processors. With the introduction of its newest Qualcomm Snapdragon 800 and 600 processors, Qualcomm continues to lead the industry by once again raising the bar on performance per watt and delivering unparalleled user experiences. 

The new Qualcomm Snapdragon 800 processors target premium mobile and computing devices. They are designed to deliver outstanding overall user experience, expand the possibilities of seamless connected computing and enable brand new mobile experiences while maintaining industry-leading battery performance:

  • The Qualcomm Snapdragon 800 processors will deliver up to 75 percent better performance than the Qualcomm Snapdragon S4 Pro processor and the move to 28nm High Performance for mobile (HPm) technology node ensures exceptionally low power
  • New Krait 400 CPU in quad configuration, with speeds of up to 2.3 GHz per core offers best-in-class performance per watt, so processor performance can hold up to the more demanding processing and communication requirements of premium mobile devices
  • Additionally, asynchronous SMP architecture provides dynamic power sensing and control for peak performance per core, while extending battery life without the use of specialized cores
  • New Adreno 330 GPU delivers more than 2x performance for compute applications over the current Adreno 320 GPU
  • 2x32bit LP-DDR3 at 800MHz with industry-leading memory bandwidth of 12.8GBps
  • New Hexagon DSP V5 delivers floating point support, dynamic multithreading and expanded multimedia instructions for enhanced low power performance
  • New IZat™ location technology combines multiple tracking systems into a single high performance, highly accurate navigation platform for auto and pedestrian applications
  • Seamless communications anytime, anywhere: Qualcomm Snapdragon 800 processors offer fully integrated connectivity and a wide variety of communication options.
  • Third generation 4G LTE modem with data rates up to 150 Mbps (Category 4), fully integrated in the new Qualcomm Snapdragon 800 processors
  • 4G LTE Advanced Carrier Aggregation feature to maximize radio frequency bandwidth
  • World multimode and multi-band support using wafer level package (WTR1605)
  • Integrated newest generation mobile Wi-Fi connectivity, 802.11ac
  • Broad connectivity support with integrated USB 3.0, Bluetooth and FM

Breakthrough multimedia experiences: The Qualcomm Snapdragon 800 processors also introduce the very latest mobile experiences.

  • Capture, playback and display in UltraHD video (with four times 1080p pixel density)
  • Dual Image Signal Processors (ISP) for Qualcomm Snapdragon Camera with support for computational camera
  • HD multichannel audio with DTS-HD and Dolby Digital Plus for enhanced audio
  • Higher display resolutions (up to 2560×2048) and Miracast 1080p HD support

The Qualcomm Snapdragon 800 processors are currently sampling and expected to be available in commercial devices by mid-year 2013.

The Qualcomm Snapdragon 600 processor targets high-end mobile devices. The Qualcomm Snapdragon 600 processor is designed to deliver great performance, rich graphics and enhanced user experience and will deliver up to 40 percent better performance than the Qualcomm Snapdragon S4 Pro processor at lower power. The new processor offers system-wide architectural improvements, key component upgrades and expanded connectivity options. The Qualcomm Snapdragon 600 processor features a new Krait 300 quad-core CPU with speeds up to 1.9GHz, a new speed enhanced Adreno 320 GPU and support for LPDDR3 memory. The Qualcomm Snapdragon 600 processor is sampling now and is expected to be available in commercial devices by second quarter 2013.

“With the overwhelming success of our previous Qualcomm Snapdragon platforms, our mobile processors have emerged as the platform of choice for high-end mobile devices,” said Steve Mollenkopf, president and chief operating officer of Qualcomm. “With more than 50 design wins already secured with the first products of the Qualcomm Snapdragon 600 and 800 processors, we are advancing our vision and setting the standard for excellence in mobile computing.”

For more information and to see a demonstration of the Qualcomm Snapdragon 800 processors, as well as the newest devices powered by Qualcomm Snapdragon processors, please visit Qualcomm during CES 2013(South Hall 3, Upper Level, Booth #30313), Jan. 8-11 in Las Vegas or visit www.qualcomm.com/snapdragon.

0

Intel CEO Paul Otellini stepping down May 2013


Intel’s CEO Paul Otellini is retiring next May and will be stepping down as CEO and president of Intel. Otellini has spent 38 years with Intel becoming the CEO on May 18th 2005 replacing Craig Barrett. Intel have sent out a press release about the announcement which you can read below. There has been no word on who will take over as the new CEO.

The board of directors will conduct the process to choose Otellini’s successor and will consider internal and external candidates for the job.

Whoever the person will be will have some pretty big shoes to fill, considering the milestones that Otellini has brought to Intel(Apple). There is no doubt huge work a head for the successor.

Intel CEO Paul Otellini to Retire in May

SANTA CLARA, Calif.–(BUSINESS WIRE)–Intel Corporation today announced that the company’s president and CEO, Paul Otellini, has decided to retire as an officer and director at the company’s annual stockholders’ meeting in May, starting an orderly leadership transition over the next six months. Otellini’s decision to retire will bring to a close a remarkable career of nearly 40 years of continuous service to the company and its stockholders.

“I’ve been privileged to lead one of the world’s greatest companies”
“Paul Otellini has been a very strong leader, only the fifth CEO in the company’s great 45-year history, and one who has managed the company through challenging times and market transitions,” said Andy Bryant, chairman of the board. “The board is grateful for his innumerable contributions to the company and his distinguished tenure as CEO over the last eight years.”

“I’ve been privileged to lead one of the world’s greatest companies,” Otellini said. “After almost four decades with the company and eight years as CEO, it’s time to move on and transfer Intel’s helm to a new generation of leadership. I look forward to working with Andy, the board and the management team during the six-month transition period, and to being available as an advisor to management after retiring as CEO.”

The board of directors will conduct the process to choose Otellini’s successor and will consider internal and external candidates for the job.

In addition, the company also announced that the board has approved the promotion of three senior leaders to the position of executive vice president: Renee James, head of Intel’s software business; Brian Krzanich, chief operating officer and head of worldwide manufacturing; and Stacy Smith, chief financial officer and director of corporate strategy.

During Otellini’s tenure as CEO — from the second quarter of 2005 through the third quarter of 2012 — Intel:

Generated cash from operations of $107 billion
Made $23.5 billion in dividend payments
Increased the quarterly dividend 181 percent from $0.08 to $0.225
From the end of 2005 through the end of 2011, Intel achieved record revenue and net income. During this period, annual revenue grew from $38.8 billion to $54 billion, while annual earnings-per-share grew from $1.40 to $2.39.

In addition to financial performance, Intel, under Otellini’s leadership, achieved notable successes in areas of strategic importance. During this period, the company:

Transformed operations and the cost structure for long-term growth
Achieved breakthrough innovations, including High-K/Metal gate and now 3-D Tri-gate transistors; and dramatic improvement in energy efficiency of Intel processors
Reinvented the PC with Ultrabook™ devices
Greatly expanded business partnerships and made strategic acquisitions that expanded Intel’s presence in security, software and mobile communications
Delivered the first smartphones and tablets for sale with Intel inside
Grew the vast network of cloud-based computing built on Intel products
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

Intel, the Intel logo and Ultrabook are trademarks of Intel Corporation in the United States and other countries.

0

Samsung announce Exynos 5 dual core processor


Samsung have just announced their latest mobile processor which is the Exynos 5. The processor is slated to take smartphones and tablets to the next level with unprecedented performance. Below is a schematic of the new architecture that will be used for the next series of processors.


The Exynos 5 is based on the ARM A15 processor and details are that it will push the performance like LPDDR3 RAM running at 800MHz with a bandwidth of 12.8GBps. Now all of these specs are on paper only and until release and until then nothing is for sure, but either way, Samsung are heading in the right direction.

Source: Samsung Exynos Blog

0

Samsung Galaxy Note 2, GT-N7100 benchmark possibly leaked


Just hours after Samsung send out invites for a mysterious Galaxy related event this August 15th, we have a nice possible clue as to what the announcement may be, or at least one of the announcements. Anyway, a new device benchmark popped up on GLBenchmark.com for a short period of time and has been taken down/removed. Anyway, the specs show the Samsung GT-N7100(Original Note being N7000) giving a nice solid results beating the Galaxy S3, but only by a short distance and this is due to it having the same Exynos quad-core 4412 processor but this time clocked at 1.6GHz and the same Mali-400 GPU.

The screen is also reported to have a resolution of 1280 x 720 which is lower than the Galaxy Note’s 1280 x 800. That being said, it’s still early days. It is no doubt the clock increase is what pushes the performance beyond that of the Galaxy S3 so there may not be any other differences in terms of power although the amount of ram is still to be seen. There has been no word from Samsung on whether or not there even will be a Galaxy Note 2, but there is certainly the market for it and the evidence of one existing sure got bigger The possibility of an announcement this coming August 15th sure sounds more promising.

0

Review: Intel DZ77GA-70K and Intel Core i7-3770k

It’s time for another review and thanks to Intel we have the lovely Intel DZ77GA-70K motherboard and Intel i7-3770k processor to play around with and check out it’s performance. So let’s not mess around here and dive right into the specs of each piece of hardware.

Intel DZ77GA-70K Motherboard

  • Memory
  • Four 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets
  • Support for DDR3 1600+ /1333 /1066 MHz DIMMs
  • Support for up to 32 GB of system memory
  • Chipset
  • Intel® Z77 Express Chipset
  • Intel® Rapid Storage Technology (Intel® RST) for RAID 0, 1, 5, and 10
  • Graphics
  • Intel® HD Graphics, HDMI*
  • Two PCI Express* 3.0 x16 connectors (one x8 electrical)
  • Supports ATI CrossFireX* and NVIDIA SLI*
  • Audio
  • Intel® High Definition Audio (Intel® HD Audio) subsystem in the following configuration:
  • 10-channel (7.1 + 2 independent multi-streaming) audio subsystem with six analog audio outputs w/optical S/PDIF out port
  • Supports Dolby* Home Theatre V4
  • LAN support
  • Dual Gigabit (10/100/1000 Mb/s) LAN subsystems using the Intel® 82579V Gigabit Ethernet Controller
  • Peripheral interfaces
  • Eight SuperSpeed USB 3.0 ports (4 external/4 header)
  • Ten USB 2.0 ports (4 external (2 Hi-Current/Fast Charging) / 6 internal)
  • Four Serial ATA 6.0 Gb/s ports, one eSATA 6.0 Gb/s
  • Four Serial ATA 3.0 Gb/s ports
  • Two IEEE 1394a ports/headers (1 external/1 header)
  • Consumer infrared receiver and emitter
  • Expansion capabilities
  • Two PCI Express* 3.0 x16 connectors (one x8 electrical)
  • Two PCI Express 2.0 x 1 connectors
  • One PCI Express 2.0 x 4 connector
  • Two PCI Conventional* bus connectors

Intel Core i7-3770k

 of Cores
4
# of Threads
8
Clock Speed
3.5 GHz
Max Turbo Frequency
3.9 GHz
Intel® Smart Cache
8 MB
Bus/Core Ratio
35
DMI
5 GT/s
Instruction Set
64-bit
Instruction Set Extensions
SSE4.1/4.2, AVX
Embedded Options Available
No
Lithography
22 nm
Max TDP
77 W

Let’s also take a look at the difference between the SandyBridge/Extreme and IvyBridge

Page 1 – Introduction
Page 2 – Photos of Motherboard and processor
Page 3 – wPrime and ATTO Disk Bench
Page 4 – AIDA64
Page 5 – PC Mark Vantage and CineBench
Page 6 – Conclusion

0

Samsung unveils new Ivy-Bridge Laptops with Nvidia GT650M Graphics


Intel’s new Ivy-Bridge processors of course means a series of new laptops to be infested with the power of the 22nm chips. Samsung have announced their new line of laptops bringing with them some impressive specs. The three new laptops are all with the model set Samsung Series 5 550p. Let’s take a look at the specs of each laptop.

Model Name

NP550P5C-A02UK

NP550P5C-S03UK

NP550P7C-S02UK

OS

W7HP

W7HP

W7HP

CPU

TBA

TBA

Intel Core i7_3610QM

Memory

8GB

8GB

8GB

Screen

15.6″ LED HD

(1366 x 768)

15.6″ LED HD

(1366 x 768)

17.3″ LED HD+

(1600 x 900)

Graphics

Shared

NVIDIA® GeForce® GT 650M (2GB)

NVIDIA® GeForce® GT 650M (2GB)

ODD

DVD-RW

DVD-RW

BluRay

WLAN

Intel 802.11abgn(2×2)

Intel 802.11abgn(2×2)

Intel 802.11abgn(2×2)

Battery

Li Ion 6Cell (5200mAh)

Li Ion 6Cell (5200mAh)

Li Ion 6Cell (5200mAh)

Webcam

Yes

Yes

Yes

Colour

Silver

Silver

Silver

Now, they all have similar specs in terms of OS, RAM and battery. The detailing parts that sets these laptops apart is the CPU and Graphics card with the lower spec laptop(A02UK) having shared graphics lower processor and the top two having 2GB Nvidia 650M graphics. The top laptop(NP550P7C-S02UK) also bringing with it a nice 17.3″ LED HD+(1600 x 900) screen and a nice Blu-Ray and a nice Core i7_3610QM, making it the king of laptops among its family.

They all comes with USB 3.0, HDMI and have an option for up to 2TB hard drive. Samsung haven’t announced any prices as of yet, but these laptops are expected to drop in the UK later this month.

0

Samsung Announces 1.4GHz Exynos 4 Quad, To be used on Galaxy S3

 

Well with the benchmark earlier today sparking concerns over the next Galaxy(Galaxy S3) device using a Dual-Core instead of Quad-Core can now be settled. It will in fact be useing a nice Quad-Core processor. The new processor just announced moments ago by Samsung is the Exynos 4 Quad and is based on the ARM Cortex A9 Quad-Core architecture. This new chip uses a 32nm die and is made using the High-K Metal Gate(HKMG) process. The new chip is said to use 20 percent less power and give twice the performance as it’s predecessor.

The quad-core processor offers phenomenal multitasking abilities surpassing any single or dual application processor. Since all the cores must share a single battery, the power management and efficiency in the limited battery capacity are indispensable for mobile computing devices,” said Taehoon Kim, vice president of System LSI marketing, Device Solutions, Samsung Electronics. “Given the diverse functionalities consumers are demanding from their mobile devices today, the Exynos 4 Quad meets those high-performance needs while keeping power consumption very low.”

The previous benchmark by the unknown user on AnTuTu could in fact prove to be real and seeing as this new chip is stated to have twice the power of the Dual-Core chips in the Galaxy Note and SGSII. Then there is no doubt the performance could infact be that much higher than the Tegra 3.

There is one thing for certain, we will find out more on May 3rd and hopefully a few more leaks closer to the launch event in London. Check out the press release about the Exynos 4 Quad below for more information.  Also a nice little video detailing the performance difference between the Exynos 4 Quad and Exynos 4 Dual

Designed on 32nm HKMG process, new energy-efficient chip exceeds 1.4GHz per core

SEOUL, Korea–(BUSINESS WIRE)–Samsung Electronics Co. Ltd., a world leader in advanced semiconductor solutions, today introduced the industry’s first quad-core application processor built on the High-k Metal Gate (HKMG) low-power process technology. With unprecedented performance capabilities exceeding 1.4GHz based on the ARM® CORTEXTM A9 quad-core, the powerful, yet energy-efficient Exynos 4 Quad, allows system-level architects to integrate maximized power efficiencies into smartphones and tablets which enables double the processing power at a 20 percent lower power bill over its predecessor, the 45nm process-based Exynos 4 Dual.

“The quad-core processor offers phenomenal multitasking abilities surpassing any single or dual application processor. Since all the cores must share a single battery, the power management and efficiency in the limited battery capacity are indispensable for mobile computing devices,” said Taehoon Kim, vice president of System LSI marketing, Device Solutions, Samsung Electronics. “Given the diverse functionalities consumers are demanding from their mobile devices today, the Exynos 4 Quad meets those high-performance needs while keeping power consumption very low.”

Multi-core processing delivers enhanced performance, enabling users to accomplish more tasks in a shorter period of time. For example, a task such as streaming video can run on one core while the other cores update applications in the background, connecting to the web and scanning virus-check simultaneously.

Benefitting from a use case where the parallel processing and workload sharing among the four cores is necessary, the Exynos 4 Quad is particularly well-suited for heavy-load applications such as 3D games, video editing, and calculation-intensive simulation.

Due to its 32nm HKMG low-power process and power-saving design, the Exynos 4 Quad has two times the processing capability over the 45nm process based Exynos 4 Dual while consuming 20-percent less power. To improve power efficiency, Samsung adopted hot-plug functionality to support on-off switching for each core as well as the per-core dynamic voltage and frequency scaling (DVFS), which offers a dramatic reduction in power consumption by adapting different levels of voltage and frequency when changing workloads.

Having identical form factor measurements (12mm X 12mm X 1.37 mm), the Exynos 4 Quad is pin-to-pin compatible with the 32nm process based Exynos 4 Dual, allowing mobile device designers to immediately adopt the new solution without additional cost, engineering or design efforts.

In addition, the new processor incorporates a full HD 30 frame per second video hardware codec engine for high resolution 1080p video recording and play-back, an embedded image signal processor interface for high-quality camera functionality and an HDMI 1.4 interface for sharp and crisp multimedia content transmission.

Samsung developed a power management IC (PMIC), the S5M8767, as a companion chip to power the Exynos 4 Quad processor. By integrating various circuitry such as nine highly efficient and programmable buck converters and 28 low-dropout regulators (LDOs) into the small package of 5.0 mm x 5.0mm x 0.4mm, the S5M8767 is designed to scale up or down the dynamic voltage depending on the clock speed in 6.25mV step for managing power delivery and maximizing battery life at the system level.

Already in production, the Exynos 4 Quad is scheduled to be adopted first into Samsung’s next Galaxy smartphone that will officially be announced in May. Samsung’s Exynos 4 Quad is also sampling to other major handset makers.

“The application processor is a crucial element in providing our customers with a PC-like experience on mobile devices. Samsung’s next Galaxy device, which will be officially announced soon, offers uncompromised performance and ground breaking multi-tasking features, thanks to Exynos 4 Quad’s powerful performance and efficient energy management technology,” said Hankil Yoon, Senior Vice President of Product Strategy Team, Samsung’s Mobile Communications Business.

Last year, Samsung introduced a new online hub dedicated to its Exynos processor. Designed to facilitate easy communication with industry partners and end users, the new micro-site takes you a step closer to the ultimate experience Exynos delivers; product information, user experience and information on promotion events. More information can be found at http://www.samsung.com/exynos.

Source: Samsung.com/exynos

0